对于先进的印刷电路板（PCB），以下是我们制造的部分典型的印刷电路板技术案例。如果您需要其他类型的先进印刷电路板，请与我们联系。我们的高科技团队会为您解决任何问题，因为我们一直都能理解客户独特的特性设计要求。我们认为您无需为了各种特殊的印刷电路板而联系众多的印刷电路板供应商，从而浪费您的时间，您只需联系我们就能满足您的需求。
| PCB Types | Technologies | Product Apppicaton |
| RF/Microwave PCB | High frequency composite PCB technology | Antenna, antenna array, directional coupler, powerdivider, filter, LNA, LNB, automobile radar |
| Multiple laminated technology | ||
| Coin | ||
| Cavity | ||
| Backdrill | ||
| Impedence control | ||
| Via on padCopper paste in via | ||
| High Multi-Layer PCB | Multi-layer laminationHigh | Antenna, antenna array, directional coupler, powerdivider, filter, LNA, LNB, automobile radar |
| High aspect ratio PCB plating | ||
| High frequency hybrid PCB technology | ||
| BackdrillImpedence control | ||
| Multiple laminated technology | ||
| HDI PCB | POFV | Mobile phones, smart watches, consumer electronics, wearing devices, etc. |
| Multiple laminated technology | ||
| Impedence control | ||
| Laser drill | ||
| High-density circuit | ||
| Cavity | Depth control | Automotive Electronics, High Current Circuit,Power Amplifier, High Speed OpticalCommunication Transmission, Electric Hybrid Computer, Radio Frequency and Microwave ApplicationsVehicle, Motor Control Module, High Speed |
| Excessive gule control | ||
| Laser slotting | ||
| Multiple laminated technology | ||
| High frequency hybrid PCB technology | ||
| Conductive Copper Paste | Copper paste in via | Automotive Electronics, Automotive BatteryManagement, High Speed Industrial Computer,Radio Frequency and Microwave Applications |
| VIA on pad | ||
| Abrasive band grinding | ||
| High frequency hybrid PCB technology | ||
| Backdrill | Depth control drilling | High Frequency and High Speed Products, Server,Medical Electronics, Military Applications,Communications Equipment |
| High frequency hybird | ||
| High multi-layer | ||
| Multiple laminated technology | ||
| Rigid-Flex PCB | Single&Double sided flexible PCB | Consumer electronics, Contractmanufacturing, High-speed digitaldevelopment,Instrumentation,LEDs andlighting,Power electronics, RF and microwaveequipment,and other industrial applications |
| Single FPC symmetrical structure | ||
| Multiple FPC book structure | ||
| Multiple FPC laminated structure | ||
| Flying tail structure | ||
| Upper and lower asymmetrical structure | ||
| Left and right asymmetric structure | ||
| Unilateral asymmetric structure |