英泰科电子有限公司具备为印刷电路板（PCB）进行几乎所有类型表面处理的能力，或者能在一块印刷电路板上结合两种以上的表面处理方式。
如果您对我们定制印刷电路板的制造能力有任何疑问，或者在选择印刷电路板表面处理方式方面需要更多帮助，请随时与我们联系。我们会迅速做出回应。
如果您在焊接过程中遇到任何与焊接相关的问题，欢迎与我们交流，因为我们拥有焊接方面的专家，能够为您提供帮助。
哪种类型的印刷电路板表面处理方式是最好的呢？实际上并不存在绝对最好的表面处理方式，您只需要选择最合适的那种就行。表面处理方式的选择应该基于印刷电路板的性能和成本要求来进行。
| Surface Finish Type | Process | Advantages | Disadvantages | Basic Feature | Storage (Best) |
| Hot Air Solder Leveling (HASL-Lead Free) | Uses molten solder and hot air knives. | Inexpensive, widely available, and good for hole plating. | Not suitable for fine-pitch components, can cause uneven surfaces. | Au THK: 1-40μm, | 6month |
| Immersion Tin(ISn) | PCB is immersed in a tin bath. | Flat surfaces, good for press-fit pin insertion. | Potential for tin whiskers, sensitive to handling. | Sn THK: 1.0-1.3μm | 3month |
| Immersion Silver(IAg) | PCB immersed in a silver bath. | Flat surfaces, good solderability. | Sensitive to handling, tarnishing, and limited shelf life. | Ag THK: 0.05-0.125μm | 3month |
| Electroless Nickel Immersion Gold (ENIG) | Nickel is plated onto the PCB, followed by a layer of immersion gold. | Flat surfaces, good for fine pitch components, long shelf life. | Expensive, potential for black pad syndrome. | Ni THK: 3-6μm Au THK: 0.03-0.10μm | 6month |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | Nickel is plated onto the PCB, followed by a layer of palladium and then immersion gold. | Excellent solderability and wire bonding capabilities. | Expensive, complex process. | Pd THK: 0.05-0.15μm, Au THK: 0.025-0.05μm | 6month |
| Organic Solderability Preservatives (OSP) | A thin layer of organic material is placed over bare copper. | Inexpensive, flat surfaces. | Limited reworkability, sensitivity to handling, and limited shelf life. | Solderable; THK: 0.2-0.5μm, | 3month |
| Hard Gold Plating | A hard, durable gold layer is plated onto the PCB. | Durable, excellent conductivity, ideal for mating surfaces. | Expensive, and not suitable for soldering. | Au：0.76um | 6month |
| Immersion Nickel Gold (IMG) | Similar to ENIG but involves immersion of gold over nickel. | Good solderability, flat surfaces. | Expensive, potential for black pad syndrome. | Ni THK: 3-6μm Au THK: 0.03-0.10μm | 6month |
| Directly Plated Copper (DPC) | A layer of copper is plated directly onto the PCB. | Good for signal integrity, suitable for high frequencies. | More complex processes may require special handling. | ||
| Electroless Nickel Electroless Palladium (ENEP) | Similar to ENEPIG, but without the final immersion gold layer. | Good solderability and wire bonding capabilities. | Expensive, complex process. | Ni THK: 3-6μm |